From manual benchtop syringe dispensing to valve systems that can be fully integrated into automated equipment, Techcon has a dispensing solution suitable for the electronics industry.
Conformal coatings on PCBA
Masking on PCBA
Flex circuit bonding
Solder paste dispensing
Dam and fill/glob top encapsulation
Surface mount adhesive (SMa) applications
Bonding camera lens
TS8200D Micro-Meter Mix was specifically developed to accurately mix and dispense 2-component (2K) material, with dispense accuracy of up to +/- 1%. Dual progressive cavity (PC) pumps achieve accurate mix ratios between 1:1 and 10:1, while the high-quality static mixer ensures proper material curing. The TS580D-MM controller ensures complete control over flow rates, mix ratios, and dispense output. It is the ideal solution for bonding, glop-top potting, filling applications, battery pack sealing, and thermal paste dispensing.
TS5000DMP/TS7000 Series Rotary Auger Valve is ideally suited for precisely depositing small amounts of solder paste onto BGA pad geometry.
TS9800 Series Jet Valve’s compact size and modular design aid integration into robotic systems. The valve features fully adjustable parameter settings, allowing the operator to change the jetting properties for different fluid types and optimize the process for repeatable dispensing. The ultra-fast and high-precision TS9800 Jet Valve is the perfect valve to dispense micro dots of UV surface mount adhesives from any direction without making contact with the substrate.
TS8100 Series Progressive Cavity (PC) Pump is a continuously volumetric dispense pump based on progressive cavity (PC) technology. The pump is designed to dispense a wide range of fluids, from low-viscosity coatings to high-viscosity greases a highly repeatable dispense output for LED encapsulant applications.
TS5540 Series Spray Valves provide the choice of round or elliptical spray patterns in conformal coating applications.
700 Series Syringes provide a very consistent feeding of the material to the valve for any dispensing applications.
TS255/TS355 Digital Fluid Dispensers provide for very low viscosity dispensing that requires precise control with lower air pressures ranging from 0 to 15 psi (0 – 1.0 bar). It also offers greater flexibility and control when administering fluids as thin as solvents or fluids as thick as solder paste.
TS250 / TS350 Digital Fluid Dispensers provide for very low viscosity dispensing that requires precise control with lower air pressures ranging from 0 to 100 psi (0 – 6.9 bar). Both configurations of benchtop dispenser/controllers offer greater flexibility and control when administering fluids as thin as solvents or fluids as thick as solder paste.
TSR2000 Series Bench-Top Dispensing Robots are easy to program and simple to operate and compatible with all valves types.
Fluid Dispensing Products Used in the Electronics Industry