Techcon offers a variety of dispensing solutions for data storage manufacturers to improve quality, speed and precision in the manufacturing process.
Solder paste dispensing
Dam and fill/glob top encapsulation
TS5000DMP Disposable Material Path rotary auger valve is an ideal valve to dispense pre-mixed 2-part material for electronics potting. The valve wetted parts can be removed and replaced in under a minute, significantly lower downtime while eliminating costly maintenance repairs and clean up.
TS70000 IMP Valve uses a feed screw to dispense fluid with a rotary displacement action and is ideally suited for precise deposition of small amounts of solder paste onto BGA pad geometry.
TS8100 Series Progressive Cavity (PC) Pump provides the most accurate metering of flux with a repeatability rate of +/-1%.
TS5540 Series Spray Valve is designed for precise spray applications of conformal coating.
Fluid Dispensing Products Used in the Data Storage Industry