Techcon offers a variety of dispensing solutions for data storage manufacturers to improve quality, speed, and precision in the manufacturing process.
Solder paste dispensing
Dam and fill/glob top encapsulation
TS8200D Micro-Meter Mix was specifically developed to accurately mix and dispense 2-component (2K) material, with dispense accuracy of up to +/- 1%. Dual progressive cavity (PC) pumps achieve accurate mix ratios between 1:1 and 10:1, while the high-quality static mixer ensures proper material curing. The TS580D-MM controller ensures complete control over flow rates, mix ratios, and dispense output. It is the ideal solution for bonding, glop-top potting, filling applications, battery pack sealing, and thermal paste dispensing.
TS5000DMP Disposable Material Path rotary auger valve is an ideal valve to dispense pre-mixed 2-part material for electronics potting. The valve-wetted parts can be removed and replaced in under a minute, significantly lower downtime while eliminating costly maintenance repairs and clean-up.
TS70000 IMP Valve uses a feed screw to dispense fluid with a rotary displacement action and is ideally suited for precisely depositing small amounts of solder paste onto BGA pad geometry.
TS8100 Series Progressive Cavity (PC) Pump provides the most accurate metering of flux with a repeatability rate of +/-1%.
TS5540 Series Spray Valve is designed for precise spray applications of conformal coating.
Fluid Dispensing Products Used in the Data Storage Industry