In the evolving market of 5G, network equipment manufacturers need high-quality and reliable 5G dispensing systems for the assembly of antennas, modems, PCBAs and other equipment vital to this growing industry. Techcon offers a number of solutions to handle the many different 5G dispensing systems while meeting the highest demands for precision and speed.


  • Solder paste dispensing PCBA for modem
  • Bonding for antenna assemblies
  • Conformal coating
  • Dam and fill/glob top encapsulation
  • Surface mount adhesive applications
  • Potting application for power adapters

  • TS9800 Series Jet Valve’s compact size and modular design aids integration into robotic systems. The valve features fully adjustable parameter settings, allowing the operator to change the jetting properties for different fluid types and optimize the process for repeatable dispensing.
  • TS8100 Series Progressive Cavity (PC) Pump is a continuously volumetric dispense pump based on progressive cavity (PC) technology. The pump is designed to dispense a wide range of fluids, from low viscosity coatings to high viscosity greases.
  • TS5540 Series Spray Valve is designed for precise spray application of low viscosity coating material. Total control of the spray is provided by adjustable fluid flow and precise control of pre-spray, atomoizing spray and post-spray with the TS560R controller.
  • TS7000 IMP Valve uses a feed screw to dispense fluid with a rotary displacement action and is ideally suited for precise deposition of small amounts of solder paste onto BGA pad geometry.
Fluid Dispensing Products Used in the 5G Industry

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