In the evolving market of 5G, network equipment manufacturers need high-quality and reliable 5G dispensing systems for the assembly of antennas, modems, PCBAs, and other equipment vital to this growing industry. Techcon offers a number of solutions to handle the many 5G dispensing systems while meeting the highest demands for precision and speed.


  • Solder paste dispensing on PCBA for modems
  • Bonding for antenna assemblies
  • Conformal coating
  • Dam and fill/glob top encapsulation
  • Surface mount adhesive applications
  • Potting application for power adapters

  • TS8200D Micro-Meter Mix was specifically developed to accurately mix and dispense 2-component (2K) material, with dispense accuracy of up to +/- 1%.  Dual progressive cavity (PC) pumps achieve accurate mix ratios between 1:1 and 10:1, while the high-quality static mixer ensures proper material curing. The TS580D-MM controller ensures full control over flow rates, mix ratios, and dispense output. It is the ideal solution for bonding, glop-top potting, filling applications, battery pack sealing, and thermal paste dispensing.
  • TS9800 Series Jet Valve’s compact size and modular design aid integration into robotic systems. The valve features fully adjustable parameter settings, allowing the operator to change the jetting properties for different fluid types and optimize the process for repeatable dispensing.
  • TS8100 Series Progressive Cavity (PC) Pump is a continuously volumetric dispense pump based on progressive cavity (PC) technology. The pump is designed to dispense a wide range of fluids, from low-viscosity coatings to high-viscosity greases.
  • TS5540 Series Spray Valve is designed for precise spray application of low-viscosity coating material. Total control of the spray is provided by adjustable fluid flow and precise control of pre-spray, atomizing spray and post-spray with the TS560R controller.
  • TS7000 IMP Valve uses a feed screw to dispense fluid with a rotary displacement action and is ideally suited for precisely depositing small amounts of solder paste onto BGA pad geometry.
Fluid Dispensing Products Used in the 5G Industry

Need More Information?

We offer a variety of materials for you to learn more about our dispensing solutions, but if you still can’t find what you are looking for, contact our engineers.